Beschreibung
InhaltsangabeIntroduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
Produktsicherheitsverordnung
Hersteller:
Springer Verlag GmbH
juergen.hartmann@springer.com
Tiergartenstr. 17
DE 69121 Heidelberg
Autorenportrait
InhaltsangabeIntroduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
Inhalt
Introduction to Microelectronics Packaging Thermal Management.- Requirements of Thermal Management Materials.- Traditional Thermal Management Packaging Materials.- Manufacturing Processes of Traditional Packaging Materials.- Development of Advanced Thermal Management Materials.- Copper Based Thermal Management Materials.- Aluminum Based Thermal Management Materials.- Cost and Performance Considerations.- System and Component Integration of Advanced Packaging Materials.- Typical Development Plan for Introduction of Advanced Materials in Products.- Future Trends.
